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Precision Motor Commutator Copper Alloy Machined Parts CNC Machining China Precision CNC Machining Services

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Precision Motor Commutator Copper Alloy Machined Parts CNC Machining China Precision CNC Machining Services

MOQ : 100

Price : 10-20

Payment Terms : L/C,D/A,D/P

Supply Ability : 10000

Delivery Time : 5-9

Test Equipment : Japan Keyence IM7000

Material Capabilities : Aluminum

Diameter : 0.325inch, 0.13inch

Oem Service : Acceptable

Size : Customized

Quality : 100% Inspection

Coaxiality : ±0.01mm

Processing : CNC machining,CNC milling,CNC turning

Service : OEM/ODM/Customized/Design

Design Software : Pro/E, Solidworks, UG

Type : Drilling,Other Machining Services

Delivery Port : Shanghai

Parallelism Tolerance : ±0.02mm

Warranty : 1 Year

Casting Method : Die Casting

Usage : Industrial

Application : Machinery

Resistance : Corrosion resistant

Original Hardness : HRC35-42

Precision : 0.001mm

The Tolerance : + -0.01mm

Casting Process : Gravity Casting

Machining Type : Milling, Grinding, Polishing

Cavity : Single

Salty Spary : 72h

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Product Description

As a technical specialist, I confirm copper heat sinks are fundamental for thermal management in electronic devices. Our precision CNC machined copper alloy heat sinks, made from pure copper base material, deliver thermal conductivity up to 401-412W/m·K, nearly double that of aluminum. These sinks efficiently absorb heat from critical components like CPUs and GPUs while maximizing surface area for heat dissipation. Copper's oxidation resistance ensures longevity, with tests showing corrosion rates as low as 0.0178mm/a in pH=8.5 water conditions, outperforming steel by 20-40 times.

Key Features
  • Advanced Thermal Management: Leverages copper's rapid heat transfer (412W/m·K) combined with expanded surface designs
  • Optimized Structure: Skiving technology enables 0.1mm thin fins with minimized pitch for maximum density
  • EMI Shielding: Optional graphite-copper composites provide 1750W/m·K horizontal conductivity and electromagnetic protection
  • Design Flexibility: Supports wave-like stamping (2mm adjustable pitch) or gradient MIM manufacturing for specialized airflow
  • Stable Base: Bases compressed under 60MPa pressure achieve 99%+ density for minimal thermal resistance
Technical Parameters
Parameter Specification
Material Pure Copper (C1100)/Copper Alloy (C1441/C1450)
Thermal Conductivity 401-412W/m·K (Pure Copper)
Operating Temperature -50℃ to 400℃ (Standard)/600℃ (Graphite Composite)
Thickness Range 0.1-3.0mm (0.01mm precision customization available)
Density 8.92g/cm³ (Pure Copper)
Surface Treatment Anti-oxidation coating (PHPS)
Insulation Optional 50-200μm resin layer, UL94V-0 rating
Applications
  • Consumer Electronics: Smartphone thermal modules, laptop CPU/GPU conduction pads (replacing aging thermal paste)
  • Industrial Equipment: Photovoltaic inverter skived heatsinks, communication base station power modules
  • Automotive Electronics: EV control system cooling modules, resistant to engine compartment temperatures
  • LED Lighting: High-power LED substrate cooling, extending lumen maintenance
  • Specialized Fields: Medical imaging systems, aerospace control system thermal management
Customization Services

We deliver end-to-end solutions: first analyzing airflow paths (side/vertical flow) to determine heatsink morphology; then employing dual-cavity MIM technology to create gradient structures combining porous fins (50%-96% density) with high-density bases; finally using trichloroethane solvent debinding and 700℃ hydrogen sintering for structural integrity. Supports standard 15*15mm to custom geometries with 7-10 day lead times.

Support & Services

Our engineering team provides thermal simulation to optimize fin height and pitch. Batch orders include complimentary first-article inspection reports with thermal resistance data. Post-sales support includes on-site installation guidance and graphite-copper composite recommendations for specialized environments.



Product Tags:

CNC machining copper alloy heat sink

      

high thermal conductivity cooling solution

      

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